A complete suite of solutions for precision 3D imaging
Capture quantitative 3D information & create vivid subcellular images
See complete biological structures and processes at the speed of light with a simple workflow
Imaging Target
Live cell, fixed cell, tissue, or single particle with fluorescent label or label-free
DHO Light Engineering
Engineer your microscope's point spread function to embed 3D and precision information within its spatial footprint
DHO Image Reconstruction
Advanced computational algorithms extract the 3D coordinates of emitters and combine them into optimized images, particle tracks, or exportable data tables
SPINDLE²®
Dual-channel 3D imaging module
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO
SPINDLE®
Single-channel 3D imaging module
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO
µSPINDLE™ & InSPINDLE™
Ultracompact objective lens insert & inspection module
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO
Phase masks
Upgrade to 3D with engineered PSFs
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO
3DTRAX®
Image reconstruction & analysis software
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO
OEM integrations
Your application, now with 3D
Inspection
Life Sciences
Detected RNA in mammalian tissue captured from 3.5 um depth in a single shot.
Image credit: DHO
Image credit: DHO
Wire bonding on computer chip.
Image credit: DHO
Image credit: DHO